What is the primary function of thermal compound in relation to the CPU?

The primary function of thermal compound is to conduct heat away from the CPU. This material, often referred to as thermal paste or thermal grease, is applied between the CPU and the heatsink to eliminate air gaps and create a more efficient thermal interface. Air is a poor conductor of heat, so the thermal compound fills microscopic imperfections on the surfaces, allowing for better heat transfer from the CPU to the heatsink, where it can be dissipated effectively. This helps maintain optimal operating temperatures for the CPU, ensuring better performance and longevity.

The other choices do not accurately describe the role of thermal compound; for example, while a CPU's processing speed can be affected by temperature, thermal compound does not inherently increase the CPU's speed. Similarly, while an electrical signal's strength is crucial in computing technologies, thermal compound does not play a role in enhancing signal strength. The notion of protecting the CPU from physical damage is also outside the scope of thermal compound's function, as its main purpose is thermal management rather than physical protection.